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 2SC5658M3T5G, 2SC5658RM3T5G NPN Silicon General Purpose Amplifier Transistor
This NPN transistor is designed for general purpose amplifier applications. This device is housed in the SOT-723 package which is designed for low power surface mount applications, where board space is at a premium.
Features http://onsemi.com
* * * * * *
Reduces Board Space High hFE, 210 -460 (typical) Low VCE(sat), < 0.5 V ESD Performance: Human Body Model; u 2000 V, Machine Model; u 200 V Available in 8 mm, 7-inch/3000 Unit Tape and Reel These are Pb-Free Devices
NPN GENERAL PURPOSE AMPLIFIER TRANSISTORS SURFACE MOUNT
COLLECTOR 3
MAXIMUM RATINGS (TA = 25C)
Rating Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current - Continuous Symbol V(BR)CBO V(BR)CEO V(BR)EBO IC Value 50 50 5.0 100 Unit Vdc Vdc Vdc mAdc
3
1 BASE
2 EMITTER
MARKING DIAGRAM
SOT-723 CASE 631AA XXM
THERMAL CHARACTERISTICS
Rating Power Dissipation (Note 1) Junction Temperature Storage Temperature Range Symbol PD TJ Tstg Max 260 150 -55 ~ + 150 Unit mW C C
2 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Device mounted on a FR-4 glass epoxy printed circuit board using the minimum recommended footprint.
XX (B9 RM M
= Specific Device Code = 2SC5658M3T5G = 2SC5658RM3T5G) = Date Code
ORDERING INFORMATION
Device 2SC5658M3T5G 2SC5658RM3T5G Package SOT-723 (Pb-Free) SOT-723 (Pb-Free) Shipping 3000/Tape & Reel 3000/Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2009
September, 2009 - Rev. 1
1
Publication Order Number: 2SC5658M3/D
2SC5658M3T5G, 2SC5658RM3T5G
ELECTRICAL CHARACTERISTICS (TA = 25C)
Characteristic Collector-Base Breakdown Voltage (IC = 50 mAdc, IE = 0) Collector-Emitter Breakdown Voltage (IC = 1.0 mAdc, IB = 0) Emitter-Base Breakdown Voltage (IE = 50 mAdc, IE = 0) Collector-Base Cutoff Current (VCB = 30 Vdc, IE = 0) Emitter-Base Cutoff Current (VEB = 4.0 Vdc, IB = 0) Collector-Emitter Saturation Voltage (Note 2) (IC = 60 mAdc, IB = 5.0 mAdc) DC Current Gain (Note 2) (VCE = 6.0 Vdc, IC = 1.0 mAdc) (VCE = 6.0 Vdc, IC = 1.0 mAdc) 2SC5658M3T5G 2SC5658RM3T5G Symbol V(BR)CBO V(BR)CEO V(BR)EBO ICBO IEBO VCE(sat) hFE Min 50 50 5.0 - - - 120 215 - - Typ - - - - - - - - 180 2.0 Max - - - 0.5 0.5 0.4 - 560 375 - - MHz pF Unit Vdc Vdc Vdc mA mA Vdc
Transition Frequency (VCE = 12 Vdc, IC = 2.0 mAdc, f = 30 MHz) Output Capacitance (VCB = 12 Vdc, IC = 0 Adc, f = 1.0 MHz) 2. Pulse Test: Pulse Width 300 ms, D.C. 2%.
fT COB
http://onsemi.com
2
2SC5658M3T5G, 2SC5658RM3T5G
TYPICAL ELECTRICAL CHARACTERISTICS
60 TA = 25C IC, COLLECTOR CURRENT (mA) 50 40 30 20 10 0 160 mA 140 mA DC CURRENT GAIN 120 mA 100 mA 80 mA 60 mA 40 mA IB = 20 mA 0 2 4 6 VCE, COLLECTOR VOLTAGE (V) 8 10 0.1 TA = 75C 1000 TA = 25C VCE = 10 V
TA = - 25C 100
1
10 100 IC, COLLECTOR CURRENT (mA)
Figure 1. IC - VCE
2 VCE , COLLECTOREMITTER VOLTAGE (V) TA = 25C COLLECTOR VOLTAGE (mV) 1.5 900 800 700 600 500 400 300 200 100 0 0.01 0.1 1 IB, BASE CURRENT (mA) 10 100 0 0.2 0.5 1
Figure 2. DC Current Gain
1
0.5
TA = 25C VCE = 5 V
5
10
20
40
60
80
100
150 200
IC, COLLECTOR CURRENT (mA)
Figure 3. Collector Saturation Region
20 7 6 Cob, CAPACITANCE (pF) 5 4 3 2 1
Figure 4. On Voltage
Cib, INPUT CAPACITANCE (pF)
18
16
14
12
10
0
1
2 VEB (V)
3
4
0
10
20 VCB (V)
30
40
Figure 5. Capacitance
Figure 6. Capacitance
http://onsemi.com
3
2SC5658M3T5G, 2SC5658RM3T5G
PACKAGE DIMENSIONS
SOT-723 CASE 631AA-01 ISSUE D
-X- b1 D
3 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. DIM A b b1 C D E e HE L L2 MILLIMETERS MIN NOM MAX 0.45 0.50 0.55 0.15 0.21 0.27 0.25 0.31 0.37 0.07 0.12 0.17 1.15 1.20 1.25 0.75 0.80 0.85 0.40 BSC 1.15 1.20 1.25 0.29 REF 0.15 0.20 0.25
A -Y- E HE b 0.08 X Y C SIDE VIEW
1 2X
2 2X
e TOP VIEW
3X 1
L
3X
L2 BOTTOM VIEW
RECOMMENDED SOLDERING FOOTPRINT*
0.40
2X PACKAGE OUTLINE 2X
0.27
1.50
3X
0.52
0.36
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
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4
2SC5658M3/D


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